March 31, 2021

What is the function of AOI detector after SMT solder paste printing?

The AOI detector can be used in multiple positions on the production line, and each position can detect special defects, but the AOI detector should be placed in a position that can identify and correct the most defects as soon as possible.SunzonTech\'s use cutting-edge technology to guarantee high speed and precision with FPC special detection logic and defect analysis.

If the solder paste printing process meets the requirements, the number of defects found by ICT can be greatly reduced. Typical printing defects include the following:

1. Insufficient solder on the pad;

2. Too much solder on the pad;

3. Poor registration of the solder to the pad;

4. The solder bridge between the pads.

In ICT, the probability of defects relative to these situations is directly proportional to the severity of the situation. Slightly small amounts of tin rarely cause defects, while severe cases, such as no tin at all, almost always cause defects in ICT. Insufficient solder may be a cause of missing components or open solder joints.

Nevertheless, deciding where to place the AOI tester needs to recognize that component loss may have occurred for other reasons, and these reasons must be included in the inspection plan. Inspection of this location most directly supports process tracking and characterization. The quantitative process control data at this stage includes printing offset and solder volume information, and qualitative information about printed solder is also generated.

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Do you know the existing problems from the utilization of AOI that should be compensated awareness to?

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